| CPU | - LGA1151 9th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W)
- LGA1151 8th gen Intel® Core™ i7/i5/i3 & Celeron® processors (35W/65W)
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| Chipset | - Intel® Q370
- Intel® C246 (optional)
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| System Memory | - 2 x 260-pin DDR4-2666 SO-DIMM, up to 64GB (ECC supported by Intel® C246 PCH)
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| BIOS | |
| COM | |
| USB | - 4 x USB 3.1 Gen2
- 2 x USB 3.1 Gen1
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| Ethernet/PoE | - 2 x 10/100/1000 Mbps (Intel® i210-IT & i219-LM)
- 4 x Power over Ethernet (IEEE802.2at), up to 60W
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| Display | - 2 x DisplayPort via optional MXM kit
- 1 x HDMI
- 1 x DisplayPort
- 1 x DVI-I
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| Digital I/O | |
| Audio | |
| Storage | - 2 x 2.5" HDD drive bay (max. up 9.5 mm height)
- 1 x mSATA (enabled in BIOS setting)
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| Expansion | - 2 x Full-size PCI Express Mini Card slot (USB + PCIe signal)
- 2 x SIM slot
- 1 x MXM3.1 type A connector
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| Others | - 1 x Flexible I/O window (Default : 2 x DB9 half cut bracket)
- 4 x SMA-type antenna connector
- TPM 2.0
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| Power | |
| Watchdog Timer | - 255 levels, 1 to 255 sec.
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| Construction | - Aluminum extrusion and heavy-duty steel, IP40
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| Operating Temperature | - Without MXM module:
-40°C to +60°C (-40°F to +140°F) (with W.T. DRAM & SSD, CPU TDP 35W)
-40°C to +50°C (-40°F to +122°F) (with W.T. DRAM & SSD, CPU TDP 65W) - With MXM module:
-40°C to +50°C (-40°F to +122°F) (with W.T. DRAM & SSD & MXM Kit, CPU TDP 35W)
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| Relative Humidity | - 10% to 90%, non-condensing
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| Shock | - IEC 60068-2-27 (w/ SSD: 50G, half-sine, 11 ms duration)
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| Vibration | - IEC 60068-2-64 (w/ SSD: 3Grms STD, random, 5 - 500 Hz, 1 hr/axis)
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Dimensions
(W x D x H) | - 280 x 210 x 80.5 mm (11.02" x 8.26" x 3.16")
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| Weight (net/gross) | - 4.8 kg (10.58 lb)/5.6 kg (12.34 lb)
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| Certifications | |
| EOS Support | |
| Software Support | |
| Mounting | - Wall mount kit
- DIN-rail kit
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